Step 1 Attachment
Attachment
The basic attachment architecture that defines the properties of the thermal interface bondline.
Select attachment principle most appropriate to your design
Gap Filling TIM
Architectures where the distance between the heat source and the heat sink is defined by mechanical features other than the interface surfaces themselves. This may be anything from simple standoffs, to a design where the PCB is mounted inside an enclosure where the heat sink forms the lid. Any other type of design with coarse tolerances or large tolerance gaps would also be recommended to select this option.

Gap Filling TIM
Distance between heat source and heat sink is defined by mechanical features
Thin Bondline TIM
Architectures where the heat sink is mounted with direct pressure against the heat source, and the interface surfaces thus nominally come in direct contact against one another. This may be anything from CPU heat sinks mounted with spring clips or screws against a component, to large IGBT modules screwed onto a liquid cold plate.

Thin bondline TIM
Distance between heat source and heat sink is defined by contact pressure
Contact Pressure
Contact Pressure
For applications where the heat sink is mounted with direct pressure against the heat source, provide the contact pressure in the interface.

Step Heat Source Dimensions
Hear Source Dimensions
These values provide the area of the heat source. If your heat source is not of a rectangular shape, determine its area, and apply the square root of that value in these fields.
The magnitude of thermal power these materials can handle is related to the heat flux – the thermal power per unit of area.
Small heat sources – square millimetres in size – can thus usually only be allowed to dissipate a few watts or fractions of watts, while large components – square decimetres – may dissipate up to several kilowatts through these materials.

Length
mm
Heat Source Length
Enter the interface’s X dimension
Width
mm
Heat Source Width
Enter the interface’s Y dimension
Step Heat Dissipation
Heat Dissipation
The magnitude of thermal power these materials can handle is related to the heat flux – the thermal power per unit of area.
Small heat sources – square millimetres in size – can thus usually only be allowed to dissipate a few watts or fractions of watts, while large components – square decimetres – may dissipate up to several kilowatts through these materials.

Thermal power
W
Thermal Power
Enter the thermal power generated in the heat source.
Step Bondline
Bondline
The “bondline” is the thickness of the thermal interface – the Z dimension.


Tolerance
Tolerance
Enter the + and – tolerances pertaining to the above distance
mm
mm
Step Case Temperature
Case Temperature
The maximum allowed temperature at the heat source interface surface.
This value needs to be higher than the heat sink temperature, entered later.


Step Heat Sink Temperature
Heat Sink Temperature
The steady-state temperature at the heat sink base (the interface surface).
This value needs to be lower than the heat source temperature, entered earlier.


Step Summary
Summary
The data you have entered are summarised below, along with three suggestions for materials that, based on entered values, are a plausible starting point to find a solution.
Congratulations!
You have completed the Nolato Compatherm Interactive Design Guide
Below you will find product suggestions based on your needs. Your order of free samples is now just one click away. It gives you possibilities to evaluate our material together with your solution. Just click the buttons below to place your free order.
Should you need to adjust values in your calculation, the ‘BACK’ and ‘CONTINUE’ buttons allow you to flip back and forth between the data entry steps and this result page.
If you have further questions feel free to contact us.
Contact pressure
Component dimensions
Length mm
Width mm
Bondline thickness
Nominal Distance mm
Pad Thickness mm
Tolerance + mm
Tolerance – mm
Suggested pad thickness mm
Thermal parameters
Heat Loss W
Maximum case temperature °C
Heatsink temperature °C
Suggested Products
Article Comparison
| Test Standard | Unit | ||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Material Type (article type) | 2P Filler | 2P Filler | Pad | 2P Filler | Pad | Pad | Paste | Paste | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | Pad | 2P Filler | 2P Filler | 2P Filler | 2P Filler | 1P Filler | 1P Filler | 1P Filler | ||
| Part. no | 9361 | 9321 | 9610 | 9390 | 9612 | 9611 | 9543 | 9532 | 9480 | 9473 | 9472 | 9471 | 9470 | 9460 | 9453 | 9451 | 9450 | 9441 | 9440 | 9434 | 9433 | 9432 | 9431 | 9430 | 9423 | 9422 | 9421 | 9420 | 9411 | 9410 | 9360 | 9344 | 9343 | 9322 | 9290 | 9263 | 9230 | ||
| Thermal Conductivity | ISO 22007-2 mod | W/(m·K) | 6 | 2 | 14 | 9.3 | 12 | 16 | 4.3 | 2.5 | 8 | 7 | 7 | 7 | 7 | 6 | 5 | 5 | 5 | 4 | 4 | 3 | 3 | 3 | 3 | 3 | 2.5 | 2 | 2.5 | 2 | 1.2 | 1 | 6 | 4 | 4 | 2 | 9 | 6 | 3.7 |
| Hardness | ASTM D2240 | Shore 00 | 45 | 25 | 40 | 40 | 20 | 20 | 40 | 40 | 60 | 30 | 28 | 40 | 8 | 40 | 40 | 28 | 10 | 40 | 60 | 60 | 25 | 40 | 40 | 9 | 40 | ||||||||||||
| Thermal Resistance @40psi | ASTM D5470 | K/W | 0.06 | 0.1 | |||||||||||||||||||||||||||||||||||
| Density | ASTM D792(Modified) | g/cm3 | 3.15 | 2.9 | 2.7 | 2.95 | 2.86 | 2.76 | 2.3 | 2.68 | 3.1 | 3.1 | 2.55 | 3.1 | 2.55 | 3.24 | 3.16 | 3.07 | 3.1 | 3.1 | 3.1 | 3 | 2.65 | 2.92 | 3.1 | 2.65 | 2.7 | 2.73 | 2.7 | 2.73 | 2.1 | 2.07 | 3.1 | 3.1 | 3.1 | 2.9 | 3.16 | 3.3 | 3.23 |
| Dielectric Breakdown Voltage | ASTM D149 | VAC/mm | 8000 | 7000 | n/a | 10000 | 10000 | Electrical conductive | 400 | 4000 | 8 000 | 8 000 | 1 500 | 8 000 | 1 500 | 10000 | 10000 | 5 000 | 7 000 | 8 000 | 8 000 | 8 000 | 400 | > 7 000 | > 8 000 | 400 | 5 000 | 5 000 | 5 000 | 5 000 | 8000 | 5 000 | 10000 | 5 000 | 5 000 | 10000 | 6000 | 6000 | 8000 |
| Volume resistivity | ASTM D257 | Ω·cm | |||||||||||||||||||||||||||||||||||||
| Colour | Visual | Green + White | Yellow | Dark Grey | Blue | Light Purple | Dark Grey | Grey | White | Blue | Pink | Light Grey | Brown | Light Grey | Light Blue | Grey | Grey | Grey | Green | Green | Blue | Grey | Brown | Blue | Grey | Pink | Light Blue /Light yellow | Light Brown | Light Blue | Light Blue | Pink | Green | Green/Pink + White | Pink + White | Yellow | Purple/Green | Pink | White | |
| Flowrate | g/min | 30 | 39 | 34 | |||||||||||||||||||||||||||||||||||
| Viscosity | Brookfield | cP | 250000 | 110000 | |||||||||||||||||||||||||||||||||||
| Thermally Conductive Filler | Ceramic | Ceramic | Ceramic, Carbon | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | Ceramic | |||
| Dielectric Constant @ 1MHz | ASTM D150 | 5.64 | 16.92 | n/a | 10 | 11.58 | n/a | 7.7 | 7.68 | 26.44 | 7.68 | 6.4 | 14.5 | 6.3 | 7.57 | 5.27 | 7.9 | 7.9 | 5.66 | 22.8 | 5.48 | 7.43 | 22.8 | 7.09 | 7.07 | 7.47 | 6.33 | 6.62 | 3.96 | 8.7 | 8.31 | 1.51 | 5.43 | ||||||
| Outgassing, TML | ASTM E595 | % | .22 | 0.14 | 0.4 | 0.35 | 0.31 | 0.2 | 0.3 | 0.15 | 0.3 | 0.3 | 0.23 | 0.3 | 0.23 | 0.13 | 0.2 | 0.04 | 0.04 | 0.1 | 0.1 | 0.1 | 0.06 | 0.051 | 0.04 | 0.06 | 0.13 | 0.1 | 0.13 | 0.06 | 0.59 | 0.06 | 0.14 | 0.1 | 0.1 | 0.1 | 0.08 | 0.1 | .1 |
| Outgassing, CVCM | ASTM E595 | % | 0.01 | 0.01 | 0.003 | 0.01 | 0.01 | 0.01 | – | ||||||||||||||||||||||||||||||
| Flammability | UL94 | V0 (3rd party lab) | V0 (3rd party lab) | V0 (3rd party lab) | V0 (3rd party lab) | V0 | – | – | – | V0 (3rd party lab) | V0 (3rd party lab) | VO (E483565) | VO (E483565) | VO (E483565) | V0 (3rd party lab) | V0 (3rd party lab) | VO (E483565) | VO (E483565) | – | – | V0 (3rd party lab) | VO (E483565) | V0 (3rd party lab) | VO (E483565) | VO (E483565) | – | VO (E483565) | – | VO (E483565) | V0 (3rd party lab) | V0 | V0 (3rd party lab) | V0 (3rd party lab) | VO (E483565) | V0 (3rd party lab) | – | – | – | |
| Viscosity Mixed | Brookfield | Pa·s | 380 | 300 | 350 | 260 | |||||||||||||||||||||||||||||||||
| Pot Life | h | 2 | 2 | 3 | 3 | 2.5 | 4 | 3 | |||||||||||||||||||||||||||||||
| Cure Time | h | 15 | 18 | 16 | 16 | 20 | 24 | 18 | |||||||||||||||||||||||||||||||
| Minimum Achievable Bond line | μm | 250 | 95 | 250 | 250 | 250 | 250 | 20 | 250 | 220 | 200 | ||||||||||||||||||||||||||||
| Thickness Min | ASTM D374 | mm | 0.25 | .1 | 0.5 | 0.25 | 0.5 | 1 | 0.5 | 1 | 1 | 1 | 1 | 0.7 | 1 | 0.5 | 0.5 | 1 | 1 | 0.25 | 0.5 | 1 | 0.25 | 0.25 | 0.5 | 0.5 | 0.5 | 0.25 | 0.5 | 0.25 | 0.25 | 0.25 | 0.25 | 0.25 | 0.25 | 0.22 | 0.2 | ||
| Thickness Max | ASTM D374 | mm | 5 | 5 | 5 | 6 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 6.0 | 6.0 | 6.0 | 6.0 | 6.0 | 6.0 | 5.0 | ||
| Deflection | ASTM D374 | mm | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.8 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 | 0.5 |



